Cooling fin assembly

ABSTRACT

A cooling fin assembly provides a plurality of cooling fins and each of the cooling fins has a cooling fin body with at least a recess part indenting toward a side thereof. The recess part has an insert space with a through hole slightly less than the entire area of the recess part for being passed through with a heat guide pipe. Further, a folded side surrounds the through hole and extending toward the side. Once a heat guide medium, which is inserted between the through hole and the heat guide pipe, is heated up to become in a state of melting during being set up, the molten heat guide medium distributes between the outer surface of the heat guide pipe and the through hole and over the folded side evenly.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to a cooling fin assembly and particularly to a cooling fin assembly joined to a heat guide pipe

2. Brief Description of the Related Art

Technology progressing rapidly to allow many high power electronic components being able to minimize the sizes thereof in order to fulfill requirement of lightness, thinness, shortness and smallness. Hence, more parts can be installed in the same size as before. For instance, the CPU (central processing unit) in a computer increases more electronic parts inside in order to obtain higher performance efficiency. Therefore, heat removal from the electronic components is a subject much more important than before. In practice, mostly cooling fins associated with a fan is used for helping the electronic components to dissipate heat. However, due to external space limitation, it is required to have lighter and smaller cooling fins with high heat transmission rate.

Under the preceding limitation, a conventional cooling fin structure is joined to a heat guide pipe for enhancing heat conductive capability. Referring to FIGS. 1 to 3 and 3 a, the conventional cooling structure with a heat guide pipe includes a plurality of cooling fins 11 and at least a heat guide pipe 12. Each of the cooling fins 11 has a through hole 111 and an projection 112 surrounding the through hole 111 at a side of the respective cooling fin 11 such that the cooling fins 11 are attacked to each other in a way of the respective through hole aligning with each other. The heat guide pipe passes through the respective hole 111 and soldering paste 13 is coated between inside the through hole and the projection 112 and the heat guide pipe 12 for binding the through holes 111 and the heat guide pipe together.

However, the problem of the preceding prior art is in that part of the coated soldering paste 13 is squeezed out and stays at the outer surface of the outermost cooling fin 11 during the heat guide pipe passing through the through holes 111. Under this circumference, the soldering paste 13 left between the through hole 111 and the projection 112 and the heat guide pipe 12 is unable to distribute evenly between the through hole 111 and the projection 112 and part of the soldering paste overflows to outside the respective projection 112 as shown in FIG. 3 a. It results in undesirable tightness and looseness between the cooling fins 11 and the heat guide pipe 12 to degrade heat conductive effect and to defect appearance thereof.

Further, when the molten soldering paste passes the respective cooling fins 11, the respective projection 112 increases flow resistance and lowers the flow rate such that effect of heat dissipation is seriously influenced and it is unable to meet the need of the high power electronic component.

SUMMARY OF THE INVENTION

In order to solve the preceding problems, an object of the present invention is to provide a cooling fin assembly in which at least a cooling fins has a cooling fin body with at least a recess part indenting toward a side thereof. The recess part has an insert space with a through hole slightly less than the entire area of the recess part for being passed through with a heat guide pipe. Further, a folded side surrounds the through hole and extending toward the side. Once a heat guide medium, which is inserted between the through hole and the heat guide pipe, is heated up to become in a state of melting during being set up, the molten heat guide medium distributes between the outer surface of the heat guide pipe and the through hole and over the folded side evenly.

BRIEF DESCRIPTION OF THE DRAWINGS

The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:

FIG. 1 is an exploded perspective view of a conventional cooling fin assembly;

FIG. 2 is an exploded sectional view of the conventional cooling fin assembly;

FIG. 3 is a sectional view of the conventional cooling fin assembly;

FIG. 3 a is an enlarged view of the part of dashed circle in FIG. 3 illustrating soldering paste residue thereon;

FIG. 4 is a perspective view of a cooling fin assembly according to the present invention;

FIG. 5 is a sectional view of a cooling fin assembly according to the present invention;

FIG. 6 is a sectional view illustrating the cooling fin assembly of the present invention being joined to a heat guide pipe in series;

FIG. 7 is a sectional view illustrating soldering paste being full between the inserted space and the clearance in the cooling fin assembly of the present invention;

FIG. 8 is a sectional view illustrating the folded side of the cooling fin assembly contacting the outer surface of the heat guide pipe tightly;

FIG. 9 is a sectional view of another configuration of a recess part in the cooling fin assembly of the present invention;

FIG. 10 is a sectional view illustrating heat conductive media being full of the recess part shown in FIG. 9; and

FIG. 11 is a sectional view illustrating another type of folded side of the cooling fin assembly contacting the outer surface of the heat guide pipe tightly.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 4 to 7, a preferred embodiment of a cooling fin assembly according to the present invention provides a cooling fin set 20, which is formed by way of a plurality of stacked cooling fins 21. Each of the cooling fins 21 at least has a recess part 221 at the main body thereof indenting to a side thereof respectively. The recess part 221 constitutes an insert space 2211 with a through hole 22 disposed about at the center near the center of the recess part 221 for being at least a heat guide pipe 23 passing through and the perimeter of the through hole 22 surrounds a folded edge 222 extending along a direction.

The insert space 2211 has a perimeter greater than the outer circumference of the heat guide pipe 23 such that a heat conductive medium 25 shown in FIG. 7 can be filled between the insert space 2211 and the heat guide pipe 23. The insert space 2211 provides a circular shape or any irregular shapes and it can be seen in the figure that the insert space 2211 is semi-cone shape and the heat conductive medium 25 is soldering paste or soldering aid agent in the embodiment.

The cooling fins 21 loosely fit with the heat guide pipe 23 and the inner diameter of the through hole 2 is greater than the outer diameter of the heat guide pipe 23. That is, a clearance 24 is provided between the folded side 222 and the outer surface of the heat guide pipe 23.

Once the heat guide medium 25 is heated up to become in a state of melting, the molten heat guide medium 25 flow toward the area between the outer surface of the heat guide pipe 23 and the through hole 22 to fill with the insert space 2211 and the clearance 24 evenly. In this way, the cooling fins 21 is capable of joining with heat guide pipe 23 firmly due to the heat conductive medium 25 having distributed between the outer surface of the heat guide pipe 23 and the through hole 2 and over the outer surface of the folded side 222.

Referring to FIG. 8, alternatively, the through hole 22 can be made to allow the inner wall surface contacting with the outer surface of the heat guide pipe 23 and the folded side 222 is arranged to contact outer surface of the heat guide pipe 23 completely. In this way, it is able to achieve the same joining effect as well.

Further, the insert space 2211 can be provided with any shapes such as a countersink shape shown in FIGS. 9, 10 and 11.

It is appreciated that the cooling fin assembly according to the present invention has the insert space 2211 thereof providing the perimeter thereof greater than the outer diameter of the heat guide pipe 23 so that there is no problem with the heat conductive medium 25 being squeezed by the heat guide pipe 23 during the heat guide pipe 23 passing through the through hole 22 done in prior art. Hence, the heat conductive medium 25 is kept in the insert space 2211 completely and is capable of melting and distributing to inside the through hole 22 of each cooling fin 21 and the outer surface of the heat guide pipe 23 evenly.

While the invention has been described with referencing to preferred embodiments thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims. 

1. A cooling fin assembly, comprising: a plurality of cooling fins, each of the cooling fins having a cooling fin body with at least a recess part indenting toward a side thereof, the recess part having an insert space with a through hole slightly less than the entire area of the recess part and a folded side surrounding the through hole and extending toward the side; and a heat guide pipe, passing through the through hole.
 2. The cooling fin assembly as defined in claim 1, wherein the inner wall surface of the through hole is greater than the outer surface of the heat guide pipe and a clearance is formed between the folded side and the outer surface of the heat guide pipe.
 3. The cooling fin assembly as defined in claim 1, wherein the inner wall surface of the through hole contact with the outer surface of the heat guide pipe and the folded side contacts with the outer surface of the heat guide pipe completely too.
 4. The cooling fin assembly as defined in claim 1, wherein the insert space has a heat conductive medium.
 5. The cooling fin assembly as defined in claim 1, wherein the heat conductive medium is a tin paste.
 6. The cooling fin assembly as defined in claim 1, wherein the insert space provides a shape of circle, semi-cone or countersink or any shapes.
 7. The cooling fin assembly as defined in claim 1, wherein the perimeter of the insert space is greater than the outer surface of the heat guide pipe. 